发明名称 |
Composition and coating to prevent current induced electro-chemical dendrite formation between conductors on dielectric substrate. |
摘要 |
The present invention comprises the use of a copper/ nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads. One embodiment of the invention comprises a substrate having adhered thereon a plurality of nickel-copper alloy current-carrying leads. Option-lly, an intermediate adhesion promoting layer is located between the substrate and the leads. Another embodiment relates to electronic circuit packages comprising a substrate (11) and copper current-carrying leads (13) wherein the exposed area of the copper current-carrying leads is overplated with a more durable metal, such as a noble metal (14), to thereby enhance the circuits' corrosion resistance, solderability and bondability. This durable metal layer is in turn plated with a nickel-containing barrier layer (15). By virtue of the alloy composition or the protective coating materials applied to the copper current-carrying leads in accordance with the present invention, electrolytic migration can be substantially reduced or eliminated. <IMAGE> |
申请公布号 |
EP0441164(A2) |
申请公布日期 |
1991.08.14 |
申请号 |
EP19910100743 |
申请日期 |
1991.01.22 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BREWER, WILLIAM DEAN;HORTON, RAYMOND ROBERT;NOYAN, ISMAIL CEVDET;PALMER, MICHAEL JON |
分类号 |
H01L21/60;H01L21/48;H01L23/498;H01L23/50;H05K1/00;H05K1/09;H05K3/24 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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