| 摘要 |
PURPOSE:To obtain a high-thickness accuracy warp-free multilayer printed wiring board without a lamination void by making copper foil dot patterns on the manufacture areas of inner-layer plates. CONSTITUTION:When a plurality of inner-layer plates consisting of copper-clad laminated plates on which circuits are formed are stacked on top of each other with intervenients of a plurality of prepregs and laminated with heat and pressure to form a multilayer board, a plurality of copper foil dot patterns 6 are made on the manufacture areas of the inner-layer plates by forming circuits. Resin flow of the prepregs in forming the multilayer board can be controlled by making the dot patterns on the manufacture areas 2 of the inner-layer plates 1. Thereby the formability of the multilayer board improves and warp after forming can be decreased. |
