| 摘要 |
PURPOSE:To enable optimum exposure and improve exposure precision, by calculating the surface shape of the whole surface of a substrate to be exposed before exposure, determining the optimum exposure plane of each shot on the basis of the above results, and driving the substrate to be exposed before exposure in a manner that the optimum exposure plane is made to coincide with an exposure reference plane every shot. CONSTITUTION:By moving a wafer stage 24, a global AF measuring shot on a wafer 1 is transferred to an AF measuring position, and the position, in the direction of an optical axis, of the surface of a substrate 1 to be exposed in a plurality of shots is detected before exposure. On the basis of all stored AF measurement data, the surface shape of the whole surface of the wafer 1 is calculated and grasped. On the basis of the above results, the optimum exposure plane of each exposure shot is calculated. By moving the wafer stage 24, one of objective shots of exposure sequence on the wafer 1 is transferred to an exposure position, and the wafer is subjected to Z and tilt driving in the manner in which the optimum exposure plane of present shot is made to coincide with an exposure reference plane. After the alignment of a mask 8 and the wafer 1 in the plane direction is performed by correction driving of X, Y, and theta on the basis of AA measurement results, the exposure of present shot is performed. |
