发明名称 METHOD AND APPARATUS FOR AUTOMATIC PUNCHING
摘要 PURPOSE:To accurately and efficiently work a substrate by setting a sensor mark on the working substrate positioning the working substrate on a matching table in accordance with the sensor mark and moving it by a prescribed stroke to be punched. CONSTITUTION:A circuit pattern part of which is a sensor mark or the circuit pattern and the working substrate having the sensor mark are mounted on the matching table 11 of a matching part 10 and sucked by it and matched in accordance with the sensor mark. Then, after matching is completed, the working substrate is sucked to a carrier table 41, transmitted to a punching part 20 and punched. Thereafter, a punched substrate is discharged and the next matched working base plate is transmitted into the punching part 20.
申请公布号 JPH03184638(A) 申请公布日期 1991.08.12
申请号 JP19890321159 申请日期 1989.12.11
申请人 ONO SOKKI CO LTD 发明人 TOYODA SEIICHIRO;FUNYU SADAO
分类号 B21D28/04;B21D43/00;B21D43/18;H05K3/46 主分类号 B21D28/04
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