发明名称 WIRE BONDING APPARATUS
摘要 PURPOSE:To automatically form a ball again without stopping the operation of an apparatus when a ball formation operation has failed and to execute a bonding operation by a method wherein, when a detector detects the abnormality of the ball formation operation, the relative position between the tip of a wire and a wire heating source is made closer and the relative position is set again in order to execute the ball formation operation again. CONSTITUTION:A ball diameter becomes too small, the amount of eccentricity of the ball center line becomes too large and so on by a bad influence such as a bend, an irregularity in a length or the like of a wire 32. When a detector detects this abnormality, a control apparatus 19 brings the relative position between the tip of the wire 32 and a wire heating source close to the relative position for a ball formation operation at this time. In a reset state to execute the ball formation operation again, a torch electrode 25 heats an abnormal ball again. At this reheating operation, the relative position between the tip of the wire 32 and the torch electrode 25 is made closer as compared with an initial heating operation; as a result, an optimum ball in which the ball diameter and the amount of eccentricity of the ball center line have been improved can be formed again by the reheating operation. Thereby, a bonding operation whose reliability is high can be executed.
申请公布号 JPH03183141(A) 申请公布日期 1991.08.09
申请号 JP19890320694 申请日期 1989.12.12
申请人 TOSHIBA SEIKI KK 发明人 SHIMADA SHUICHI
分类号 H01L21/60 主分类号 H01L21/60
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