发明名称 MULTILAYER PRINTED-CIRCUIT BOARD
摘要 PURPOSE:To provide a multilayer printed-circuit board having high-frequency characteristics by laminating inner layers each having, on its upper and/or lower side, a resin layer that includes resin-impregnated fluororesin paper. CONSTITUTION:A desired number of inner layers are laminated and covered with cladding to form a multilayered printed-circuit board. The inner layer has, on its upper and/or lower side, a resin layer that includes fluororesin paper impregnated with resin. The fluororesin fiber may be made of resin: for example, trifluorochloroethylene, tetrafluoroethylene, tetrafluoroethylene- hexafluoropropylene copolymer, or tetrafluoroethylene-perfluorovinyl ether copolymer. The paper preferably has an elongation percentage of 150-350%. Below 150% the paper is liable to breaking, while above 350% it may have a residual strain, causing instability in dimension.
申请公布号 JPH03183194(A) 申请公布日期 1991.08.09
申请号 JP19890321668 申请日期 1989.12.12
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 FUJIKAWA SHOJI;IKOMA SUNAO
分类号 H05K3/46 主分类号 H05K3/46
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