发明名称 MULTILAYER PRINTED-CIRCUIT BOARD
摘要 PURPOSE:To provide a multilayer printed-circuit board having high-frequency characteristics by laminating inner layers each having, on its upper and/or lower side, a resin layer that includes resin-impregnated fluororesin paper. CONSTITUTION:A desired number of inner layers are laminated and covered with cladding to form a multilayered printed-circuit board. The inner layer has, on its upper and/or lower side, a resin layer that includes fluororesin- impregnated paper. The paper should be 30-350 microns thick. If it is thinner than 30mum, it may break during handling; if thicker than 300mum, it may break during impregnation. The cladding can be made of copper, aluminum, iron, nickel, zinc, or alloy foil. The metal foil may have adhesive on one side.
申请公布号 JPH03183192(A) 申请公布日期 1991.08.09
申请号 JP19890321666 申请日期 1989.12.12
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 FUJIKAWA SHOJI;IKOMA SUNAO
分类号 H05K3/46 主分类号 H05K3/46
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