| 摘要 |
<p>PURPOSE: To prevent an integrated circuit mounted on a circuit board from being affected even under a strong acceleration force or an adverse atmospheric environment by utilizing a ceramic tape co-baked at a low temperature available on the market. CONSTITUTION: A core section has a first circuit board 11 formed by piling up upon another three to five layers of a ceramic tape 12 which has flexibility before baking and can be co-baked at a low temperature. Various kinds of electrical conducting passages are formed on one surface, both surfaces, or in the layers of the tape 12 by using the screen printing technique, vacuum sputtering technique, etc. When circuit boards 11, 15, and 16 composed of co- baked ceramic tapes are laminated upon another, the laminated body is changed to a hardened multilayered circuit board by baking the laminated body at a high temperature of about 850 deg.C in the air before inserting an integrated circuit.</p> |
