| 摘要 |
<p>PURPOSE:To prevent a second glass protective film from being stripped off and chipped by a method wherein a protective film made of a synthetic resin is formed on the surface of the second glass protective film. CONSTITUTION:The surface of a second glass protective film 7 is coated with a synthetic resin such as a silicone resin, an epoxy resin, a polyimide resin or the like in the state of a paste dissolved by a solvent; after that, the resin is dried and hardened to form a protective film 8 made of the synthetic resin. Then, a base-material substrate A is broken into rod-shaped blank substrates A1 along transverse stripe lines a2. Then, both side-faces at the right and the left of each chip substrate 2 are coated with a conductive polymer, which is composed by mixing a conductive filler or the like of a metal fine powder or the like with a synthetic resin, in the state of a paste dissolved by a solvent in such a way that the polymer is piled up on surface electrode films 3a, 3b; after that, the polymer is dried and hardened to form side-face electrode films 9a, 9b made of the synthetic resin. Each chip substrate 2 is broken along longitudinal stripe lines a1 to manufacture chip resistors 1.</p> |
