| 摘要 |
PURPOSE:To offer printed boards excellent in solder heat resistance and in molding workability by using a melt-moldable liquid crystal polyester having a specific structural unit. CONSTITUTION:Used is a melt-moldable liquid crystal polyester comprising structural units I, II, III and IV where structural unit I has a 40-90mol% of [I+II+III] and structural units II/III have mol ratios 9/1-1/9. Preferably the structural unit I is a polyester prepared from p-hydroxy benzoic acid; structural unit II is a structural unit consisting of 4,4'-dihydroxybiphenyl; structural unit III is 2,6-dihydroxynaphthalene; and structural unit IV is terephthalic acid. In the case of loading a liquid crystal polyester with filler, preferable loading is 200wt% or less to the liquid crystal polyester 100wt%, particularly, 15-100wt%. |
