Method and apparatus for testing electronic circuit components.

摘要

A method and apparatus are disclosed for testing integrated circuit devices (10). A ferromagnetic test substrate (16) is manufactured, utilizing a process substantially similar to the process utilized to create the integrated circuit devices to be tested, such that the test substrate and the integrated circuit devices are thermally matched. The test substrate preferably includes a plurality of electrical contact points which correspond to a plurality of electrical contact points within the integrated circuit device. By aligning the ferromagnetic test substrate and integrated circuit device to be tested in a position proximate to an electromagnet (14) and selectively energizing the electromagnet, the electrical contact points within the ferromagnetic test substrate are magnetically urged into contact with the electrical contact points within the integrated circuit device. An integrated circuit device tester (20) is then electrically coupled to the ferromagnetic test substrate and utilized to test each integrated circuit device during this magnetically induced electrical connection. In one embodiment of the present invention, a second electromagnet (28) having a magnetic polarity opposite that of the first electromagnet is provided and positioned opposite the first electromagnet such that upon energization the electromagnets are urged together, further ensuring electrical contact between the test substrate and the integrated circuit device. In this embodiment, a flexible cushion (30) is provided to equally distribute the pressure between the two electromagnets.