| 摘要 |
A thin film (18) adhering apparatus and method in which a thin film whose length corresponds to that of a substrate is adhered to the substrate by applying pressure using a pressure adhering roller (11). The apparatus includes a substrate conveyance mechanism (6) for conveying the substrate to a thin film adhering position and conveying the substrate from that position; a thin film feeding member for suctioning the leading edge portion of the continuous thin film and supplying the leading edge portion to the adhering position; a leading edge portion holding member (16) having a holding side which comes into surface contact with the leading edge portion of the thin film, the holding side having suction holes (16c) communicating with a vacuum suction system for suctioning the leading edge portion of the film, the continuous thin film held in the thin film adhering position by the holding member being adhered to the thin film adhering side of the substrate from the leading edge portion of the film and the substrate to the trailing edge portion thereof by the pressure adhering roller (11); and a cutter (13A) for cutting the continuous thin film at the trailing edge portion thereof to the length corresponding to that of the base. |
