Metal base wiring board

摘要

A metal base wiring board comprises a metallic plate (1) having adhered thereto a circuit-forming conductive metallic foil (3') via an insulating film (2) formed of a resin having a high glass transition point. An adhesive layer (not shown) having a thickness of not more than 10 mu m is interposed between the metallic plate (1) and the film (2) and between the film (2) and the metallic foil (3'). The gaps formed by etching the foil (3') to create the circuit pattern are filled with insulating resin (6). The foil (3') may comprise a layer (31) of aluminium or nickel and a layer (32) of copper.