| 摘要 |
A photoresist exposure method in which a photoresist that is coated by electrodeposition on the surface of a printed circuit board having been subjected to through-hole plating and on the inner wall surfaces of through-holes therein is exposed to light through a film, comprises the first step of exposing the resist electro-deposited on the inner wall surfaces of the through-hole with a light source positioned adjacent to the board and rotated horizontally along the board surface, and the second step of exposing the resist on the board through a film for forming a precise pattern with a light source positioned remote from the board surface.
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