| 摘要 |
<p>PURPOSE:To facilitate local mounting and dismounting of an LSI by a method wherein a high temperature heating circuit for flip chip counting is provided on a hybrid board. CONSTITUTION:Preparatory solder is applied to the LSI side pads 6 of an LSI 2 or/and to the board side pads 3. After the pads 6 are placed on the pads 3, if a voltage is applied between power supply electrodes 5a and 5b, a resistor pattern 4 is heated and the preparatory solder on the LSI side pads 6 or/and the board side pads 3 is melted and both the pads are connected to each other with solder 7. LSI's on the board are interconnected through through-holes 9 and blind via-holes 10. Thus, only the high temperature heating circuit of the necessary part is selected to generate heat. With this constitution, if only one of the mounted LSI's is to be dismounted, only the specific high temperature heating circuit is operated to melt the soldered part of the necessary LSI and dismount it without giving any influence upon the other surrounding LSI's.</p> |
