发明名称 METHOD, APPARATUS, AND MOLD FOR SEALING ELECTRONIC PARTS WITH RESIN
摘要 PURPOSE:To improve slide characteristics of each plunger and enhance the durability of a resin-sealing mold assembly by applying required oscillation action to each plunger and/or each pot. CONSTITUTION:When a screw shaft moves up, the top end part 1202 of each plunger pressurizes a resin material R in each pot 114, respectively. However, when the applied pressure reaches a preset fixed level or above, each plunger 120 in upward movement moves down relatively with respect to a plunger holder 140. Since upward elasticity is applied to each plunger 120 by an elastic pressing member 121 via a seating 122, the respective resin materials R are subjected to a substantially equal pressure due to the elasticity. Furthermore, since each resin material R is heated by a heater to be melted in each pot 114 and is injected to be packed into a twin type cavity 116 through a resin passage 115 under pressure applied by each plunger 120, the molten resin materials injected and packed are molded to seal electronic parts in the twin type cavity 116.
申请公布号 JPH03180310(A) 申请公布日期 1991.08.06
申请号 JP19890319480 申请日期 1989.12.08
申请人 TOOWA KK 发明人 OSADA MICHIO
分类号 F16J15/14;B29C33/14;B29C45/02;B29C45/14;B29C45/26;B29C45/34;B29C45/53;B29C45/66;B29K105/20;B29L31/34;H01L21/56 主分类号 F16J15/14
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