发明名称 Method of manufacturing semiconductor device
摘要 A semiconductor device of a multilayer structure comprising semiconductor materials of different properties manufactured by using at least a step of epitaxially forming a semiconductor material layer on a substrate and a passivation film layer thereover, a step of introducing impurities into specific portions of the epitaxially formed semiconductor material layer and a step of removing the passivation film layer formed directly above the epitaxially formed semiconductor material layer within an epitaxial device and then applying epitaxial growing. Impurities introduced additionally to specific portions of the layer inside are substantially eliminated at the boundary adjacent the layer above the region introduced with impurities and the properties of the thus-produced semiconductors vary abruptly at the boundary between the layer in which the impurities are introduced and the layer thereabove. The material used for the passivation film layer comprises one that can be epitaxially formed and easily removed at a temperature and in a atmosphere under which the epitaxially formed layer below the passivation film are not decomposed or evaporized.
申请公布号 US5037769(A) 申请公布日期 1991.08.06
申请号 US19890330956 申请日期 1989.03.28
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 INADA, MASANORI;EDA, KAZUO;OTA, YORITO
分类号 H01L29/36;H01L29/737 主分类号 H01L29/36
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