发明名称 |
Method and apparatus for wire bonding |
摘要 |
The present invention relates to a ball bonding technique using an insulated wire in assembling a semiconductor chip in which the ball is formed at the end of an insulated wire by an electrical discharge and the insulation at a portion of the wire to be bonded a predetermined distance from one end of the wire is removed by an electrical discharge.
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申请公布号 |
US5037023(A) |
申请公布日期 |
1991.08.06 |
申请号 |
US19890442149 |
申请日期 |
1989.11.28 |
申请人 |
HITACHI, LTD. |
发明人 |
AKIYAMA, YUKIHARU;OSHIMA, YOSHIO |
分类号 |
B23K20/00;H01L21/60;H01L21/607;H01L23/49 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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