| 摘要 |
PURPOSE:To obtain a printed board for a hybrid IC which is resistant to stress by controlling the thicknesses of plated films differently for the main surface of the board and the rear surface opposing the main surface, and making the thickness of the conductor pattern film at the rear surface of the board larger than the thickness of the conductor pattern film at the main surface of mounting. CONSTITUTION:The film thickness of a conductor pattern 3 at the rear surface of a board 1 on which wirings mainly for contact with other mounted parts are formed is made lager than the film thickness of a conductor pattern on the main surface of the board 1 which is to become mainly the mounting surface. The film thickness of the conductor pattern 3 to be differentiated is determined by, e.g. the area of the board 1 and the degree of a resin coating 8 on a semiconductor bare chip 5. The thickness is realized by controlling the different plating thicknesses for the main surface and the rear surface of the board in a plating step for forming the conductor pattern 3. In this way, the highly reliable printed board for the IC without the strain in the board 1 due to stress is obtained at a low cost even in the conventional manufacturing process. |
