X-RAY IMAGING SYSTEM AND SOLID STATE DETECTOR THEREFOR

摘要

The x-ray detector comprises a plurality of closely adjacent radiation sensing arrays facing a plurality of preprocessing circuits. Bump bonds are connected directly from said sensing arrays to said preprocessing circuits. Added absorber material may be included next to the sensing arrays for converting impinging x-rays to free electrons for affecting a charge on the sensing arrays. Alternately, a scintillator may be positioned between the sensing arrays and the preprocessing circuits and sensing cells in the sensing arrays may be exposed to the scintillator.