| 摘要 |
<p>PURPOSE:To obtain the title wiring board of low dielectric constant, enabling high-density wiring, by impregnating or coating a porous ceramic form with a fluororesin. CONSTITUTION:The objective ceramic board can be obtained by impregnating and/or coating a porous ceramic form with a fluororesin. This impregnation or coating process will obtain a ceramic board with practical mechanical strength by reinforcing its original low mechanical strength with its characteristic low dielectric constant intact because of the fluororesin's low dielectric constant. The present ceramic board, despite its porous nature, has such dimensional stability and heat releasability as to be compared to those of conventional ceramic boards; therefore, wiring can be highly densified and resultantly capable of shortening wiring distance. To fill or coat the porous ceramic form with the fluororesin, the resin to be used should be, where needed, soluble in solvents or dispersible in dispersants.</p> |
