MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PURPOSE:To prevent the falling of a broken piece, produced on the intersection line between the back surface and the side surface of a semiconductor chip, on the surface of the other chip when it is transported by transferring the semiconductor chip separated through full-cut dicing onto the surface of a UV tape applied to the other frame and hardening the UV tape through irradiation with ultraviolet rays, and then transferring it to the other container. CONSTITUTION:A UV tape 2 is applied to a dicing frame 1 and a semiconductor wafer 3 is applied onto the surface of the tape 2, and the semiconductor wafer 3 is divided into individual chips 4 by full-cut dicing and the UV tape 2 is irradiated with ultraviolet rays to be hardened. Next, the chips 4 are removed from the UV tape 2 by using an air-pincette to be transferred and applied on a UV tape 6, which is in turn applied to a frame 5 mounted on an XY stage, in alignment with each other. Then, this UV tape 6 is heated to strengthen the adhesion thereof. Finally, this UV tape 6 is irradiated with ultraviolet rays to harden the UV tape 6 and the chips 4 are removed and fed to the next assembling process and mounted in a container for a semiconductor device. At that time, a broken piece adhering to the semiconductor chip 4 can be separated by causing it to adhere the UV tape 6.