| 摘要 |
<p>A polishing pad for semiconductor wafers (P), having a face (25) shaped by a series of voids (27, 37, 33). The voids are substantially the same size, but the frequency of the voids increases with increasing radial distance to provide a constant, or nearly constant, surface contact rate to a workpiece (P) such as a semiconductor wafer, in order to effect improved planarity of the workpiece. <IMAGE></p> |
