| 发明名称 |
Substrate for packaging a semiconductor device, packaging structure and method. |
| 摘要 |
<p>A substrate (3) for packaging a semiconductor device having a bump (2) thereon according to the present invention is characterized in that the substrate (3) has an electrode terminal (5) to which the bump (2) is to be connected and a recess (4) for receiving at least a top of the bump (2) is formed in the electrode terminal (5). <IMAGE></p> |
| 申请公布号 |
EP0439134(A2) |
申请公布日期 |
1991.07.31 |
| 申请号 |
EP19910100818 |
申请日期 |
1991.01.23 |
| 申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
NISHIGUCHI, MASANORI, C/O YOKOHAMA WORKS OF;MIKI, ATUSHI, C/O YOKOHAMA WORKS OF |
| 分类号 |
H01L21/60;H01L23/13;H05K1/00;H05K3/34;H05K3/40 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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