PHOTOCURABLE RESIN COMPOSITION

摘要

A photocurable resin composition comprising (a) a modified resin prepared by reacting an .alpha.,.beta.-unsaturated dicarboxylic acid anhydride adduct having a softening point ranging from 70 to 200 .degree.C and derived from a conjugated diene polymer or copolymer having a number average molecular weight of 500 to 5000 and a vinyl content of 50 mole % or above, with an .alpha.,.beta.-unsaturated monocarboxylic acid ester having an alcoholic hydroxy group represented by the following formula (I), (I) wherein R1 and R2 each represent hydrogen or methyl, and R3 represents a hydrocarbon residue having at least 2 carbon atoms which may contain a heteroatom therein, to cause ring opening at least 10 mole % of the acid anhydride present in the adduct, (b) a wax having a melting point of not higher than 100 .degree.C, and (c) a photopolymerization initiator.