发明名称 |
COLLIMATED DEPOSITION APPARATUS AND METHOD |
摘要 |
Sputtering apparatus and method which are particularly suitable for forming step coatings. A workpiece is supported in a chamber, particles are emitted from a sputter source in a substantially uniform manner throughout an area of greater lateral extent than the workpiece, the pressure within the chamber is maintained at a level which is sufficiently low to prevent substantial scattering of the particles between the source and the workpiece, and the particles are passed through a collimating filter having a plurality of transmissive cells with a length to diameter ratio on the order of 1:1 to 3:1 positioned between the source and the workpiece to limit the angles at which the particles can impinge upon the workpiece.
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申请公布号 |
CA2035106(A1) |
申请公布日期 |
1991.07.30 |
申请号 |
CA19912035106 |
申请日期 |
1991.01.28 |
申请人 |
VARIAN ASSOCIATES, INC. |
发明人 |
DEMARAY, R. ERNEST;HOFFMAN, VANCE E.;HELMER, JOHN C.;PARK, YOUNG H.;COCHRAN, RONALD R. |
分类号 |
C23C14/04;C23C14/35;H01J37/34;(IPC1-7):C23C14/34;C23C14/56 |
主分类号 |
C23C14/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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