| 摘要 |
A chip-type solid electrolytic capacitor comprises a capacitor element having a top surface, a bottom surface, and a side surface extending therebetween. An insulating resin layer is coated on the top and side surfaces of the element leaving the bottom surface exposed. An anode lead wire extends through the top surface from the insulating resin layer. An electroless plated layer is formed directly on the anode lead wire and the insulating resin layer at a region located on the top surface and a part of the side surface. Another electroless plated layer is also formed on the cathode layer on the bottom surface. Furthermore, solder layers are formed on the each electroless plated layers.
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