发明名称 ATTACHING METHOD OF DICE
摘要 PURPOSE:To prevent a harmful effect due to evaporation of a metallic paste on heat-treatment by a method wherein when heat-treatment is performed, after a chip is placed on a mounting surface with an intermediary of a metallic paste, evaporated component of a metallic paste is exhausted. CONSTITUTION:After a chip 3 is attached with an intermediary of a metallic paste 4 which is mixed with Ag on a mounting surface 2 on lead frames 1 stretching in a row as a tape, they are placed on a heating block 10 of a dice attaching apparatus and heated. By a ventilating hole 11 connected to a rotary pump 12 placed above the chip 3 in this arrangement, a solvent evaporated from the metallic paste is exhausted through the ventilating hole 11, and consequently it can not be attached on the lead frame 1 and a surface of the chip 3. By this method, the contamination, accompanying the heat treatment for hardening metallic paste in the fixing of dice, caused by the use of low cost metallic paste can be avoided.
申请公布号 JPS57104231(A) 申请公布日期 1982.06.29
申请号 JP19800179822 申请日期 1980.12.19
申请人 FUJITSU KK 发明人 SERIZAWA KOUJI;KUBOTA AKIHIRO
分类号 H01L21/52;H01L21/58;(IPC1-7):01L21/58 主分类号 H01L21/52
代理机构 代理人
主权项
地址