Manufacture of printed circuit boards

摘要

In the manufacture of printed circuit boards, a first photoresist post is patterned on the substrate where via holes are to be made. A dielectric layer is put down, a second photoresist layer patterned so as to have openings over and in alignment with the photoresist posts, and the dielectric removed from the via holes. Barrier layers to reduce interaction between layers of copper, dielectric and photoresist during filling of the via holes with a conductor via fill ink are also described.