发明名称 |
Electronic component mounting apparatus |
摘要 |
An electronic component or chip mounting apparatus capable of carrying out a chip mounting operation at a high speed and with high accuracy. The apparatus includes two transition stations, a chip extracting head reciprocating between a chip feed section and the transition stations and two chip depositing heads arranged for reciprocating between the transition stations and a substrate on which a chip is to be mounted, so that a chip mounting operation may be carried out according to a reciprocating relay system and an operation of depositing the chip on the substrate may take place with high efficiency.
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申请公布号 |
US5035047(A) |
申请公布日期 |
1991.07.30 |
申请号 |
US19890367254 |
申请日期 |
1989.06.16 |
申请人 |
TDK CORPORATION |
发明人 |
HARIGANE, KOTARO;TAKAHASHI, KENICHI;HONDA, HIROAKI |
分类号 |
H05K13/04 |
主分类号 |
H05K13/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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