发明名称 PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To reduce a noise generated at an external lead terminal to a minimum and to reduce an attenuation of a signal to a minimum at the external lead terminal by a method wherein an insulating container is formed of a forsterite sintered substance or a zirconia sintered substance, the external lead terminal is formed of a metal of a specific physical property and a glass member is formed of a glass of a specific composition. CONSTITUTION:An insulating substrate 1 and a lid body 2 are formed of a forsterite sintered substance or a zirconia sintered substance; glass members 6, for sealing use, applied to opposite main faces of the insulating substrate 1 and the lid body 2 are formed of a glass composed of the following: 60.0 to 70.0wt.% of silica; 10.0 to 20.0wt.% of at least one kind of oxides of sodium and potassium; and 5.0 to 15.0wt.% of barium oxide. Regarding external lead terminals 5, their permeability is 200 (CGS) or lower, their electric conductivity is 10% (IACS) or higher and their coefficient of thermal expansion is 100 to 110X10<-7>/ deg.C.
申请公布号 JPH03173160(A) 申请公布日期 1991.07.26
申请号 JP19890312728 申请日期 1989.11.30
申请人 KYOCERA CORP 发明人 MATSUMOTO HIROSHI;IGUCHI MASAAKI
分类号 H01L23/08;H01L23/10;H01L23/50 主分类号 H01L23/08
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