| 摘要 |
<p>PURPOSE:To integrate a housing and an electric circuit board and to omit a board exclusive to printed wiring by using a pare-type aramid film or its laminate. CONSTITUTION:A card-shaped housing substrate having an opened recessed part 2 for mounting electronic components 3 composed of a pare-type aramid film is formed by a hot pressing molding method using a material. Electric wiring 4 is provided on this substrate and electric components 3 such as an IC chip, a capacitor, a connector or the like are soldered thereto and a surface plate 5 or 5' is mounted to the single surface or both surfaces thereof by adhesion. Since the pare-type aramid film having both of heat resistance and hot pressing moldability is used as a substrate material in this process, an IC card having perfect soldering heat resistance and showing high reliability and high accuracy can be formed and, since hot pressing molding can be performed in a relatively easy manner and a printed circuit board can be omitted, a product can be miniaturized and reduced in its wt.</p> |
