发明名称 PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To surely input a signal to and output it from a semiconductor element housed at the inside by a method wherein an insulating container is formed of spinel or a steatite sintered substance, an external lead terminal is formed of a metal of a prescribed characteristic and a glass member is formed of a glass having a prescribed composition. CONSTITUTION:An insulating container is formed of spinel or a steatite sintered substance; external lead terminals are formed of a metal whose permeability is 200 (CGS) or lower, whose coefficient of thermal expansion is 70 to 85X10<-7>/ deg.C and whose electric conductivity is 50% (IACS) or higher; glass members are formed of a glass composed of the following: 30.0 to 50.0wt.% of silica; 10.0 to 30.0wt.% of a lead oxide; 5.0 to 15.0wt.% of boron oxide; 5.0 to 15.0wt.% of barium oxide; 5.0 to 10.0wt.% of bismuth oxide; 1.0 to 10.0wt.% of alumina; and 10.0wt.% or lower of calcia. Recessed parts used to form a space to house a semiconductor element are formed in respective central parts of an insulating substrate 1 and a lid body 2; the semiconductor element 4 is attached, bonded and fixed to the bottom in the recessed part of the insulating substrate 1 via an adhesive such as a resin, a glass, a brazing agent or the like.
申请公布号 JPH03173161(A) 申请公布日期 1991.07.26
申请号 JP19890312729 申请日期 1989.11.30
申请人 KYOCERA CORP 发明人 MATSUMOTO HIROSHI;IGUCHI MASAAKI
分类号 H01L23/08;H01L23/10;H01L23/50 主分类号 H01L23/08
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