发明名称
摘要 PURPOSE:To improve gap accuracy by providing two-layered thin films consisting of quartz and lead-contg. glass on the front gap forming surface of an Fe-Al-Si alloy magnetic core and a thin Ag-Cu-In alloy film on the back gap forming surface thereof and subjecting these films to diffusion joining. CONSTITUTION:Chips 1, 2 of a pair of ship-type head pieces formed with winding grooves 6 by a diamond grindstone onto a bar-shaped Fe-Al-Si alloy magnetic core material are manufactured. The front gap surface 7 and the back gap surface 9 thereof are polished to a specular surface. The thin SiO2 films 3 are formed on both surfaces 7 and the thin lead-contg. glass film 4 is formed on the films 3. 7th thin Ag-Cu-In alloy films 5 are formed on both surfaces 8. The chips are subjected to a heat treatment in a non-oxidizing atmosphere of the softening temp. of the lead-contg. glass and the temp. at which the liquid phase of the Ag-Cu-In alloy is produced or above while the surfaces 7 and 8 are held butted to each other. The surfaces are thereby diffusively joined. The magnetic gap is thus formed with good accuracy and the mechanical joint strength is improved.
申请公布号 JPH0349127(B2) 申请公布日期 1991.07.26
申请号 JP19840266693 申请日期 1984.12.18
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SAKAI MASAYUKI;AOKI MASAKI;TORII HIDEO;OKINAKA HIDEYUKI
分类号 G11B5/23;G11B5/127;G11B5/147;G11B5/235 主分类号 G11B5/23
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