发明名称 |
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摘要 |
PURPOSE:To improve gap accuracy by providing two-layered thin films consisting of quartz and lead-contg. glass on the front gap forming surface of an Fe-Al-Si alloy magnetic core and a thin Ag-Cu-In alloy film on the back gap forming surface thereof and subjecting these films to diffusion joining. CONSTITUTION:Chips 1, 2 of a pair of ship-type head pieces formed with winding grooves 6 by a diamond grindstone onto a bar-shaped Fe-Al-Si alloy magnetic core material are manufactured. The front gap surface 7 and the back gap surface 9 thereof are polished to a specular surface. The thin SiO2 films 3 are formed on both surfaces 7 and the thin lead-contg. glass film 4 is formed on the films 3. 7th thin Ag-Cu-In alloy films 5 are formed on both surfaces 8. The chips are subjected to a heat treatment in a non-oxidizing atmosphere of the softening temp. of the lead-contg. glass and the temp. at which the liquid phase of the Ag-Cu-In alloy is produced or above while the surfaces 7 and 8 are held butted to each other. The surfaces are thereby diffusively joined. The magnetic gap is thus formed with good accuracy and the mechanical joint strength is improved. |
申请公布号 |
JPH0349127(B2) |
申请公布日期 |
1991.07.26 |
申请号 |
JP19840266693 |
申请日期 |
1984.12.18 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
SAKAI MASAYUKI;AOKI MASAKI;TORII HIDEO;OKINAKA HIDEYUKI |
分类号 |
G11B5/23;G11B5/127;G11B5/147;G11B5/235 |
主分类号 |
G11B5/23 |
代理机构 |
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代理人 |
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