HALBLEITERANORDNUNG MIT EINER VERKAPSELUNGSPACKUNG.

摘要

A heat-resistant plastic-packaged semiconductor device comprises an IC chip (13) having contacts on one side, an island (12) on which the IC chip (13) is mounted with its opposite surface facing one side of the island (12), a low-adhesion layer (17) which is formed on the other surface of the island (12), external leads (11), bondig wires (14) for connection to the contacts on the IC chip (13) and inner ends of the external leads (11), a package (15) of moulded resin for encapsulating the IC chip (13), the low-adhesion layer (17), the bonding wires (14) and inner parts of the external leads (11), the moulding being provided with a vent hole (18) which extends to the vicinity of the low-adhesion layer (17). The low-adhesion layers (17) has a low or no adhesive power with respect to moulding.