发明名称 Modifying distributed feedback laser grid - etches grid by ion beam such that treated part-region remain ridges in place of grid depressions
摘要 The modified distributed feedback laser grid (1) is located in a semiconductor component. At least a partial region (5) of the grid etched by an ion beam such that in the partial region remains ridges (10) at the points of the original grid groove. The ridges have dimensions sufficient for the distributed feedback laser grid. Pref. the partial region is separated from the remaining laser grid by at least one line orthogonal to the grid grooves. The separation may be also provided by a line parallel to the grid grooves. A complementary region (4) of the grid may be so etched that the ridge extension remains preserved w.r.t. the original grid. USE/ADVANTAGE - For the mfr. of semiconductor lasers, with simple mfr. with a portion shifted by a half-grid period.
申请公布号 DE4001726(A1) 申请公布日期 1991.07.25
申请号 DE19904001726 申请日期 1990.01.22
申请人 SIEMENS AG, 1000 BERLIN UND 8000 MUENCHEN, DE 发明人 WOLF, THOMAS, 8000 MUENCHEN, DE
分类号 H01S5/12 主分类号 H01S5/12
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