| 摘要 |
<p>PURPOSE:To prevent the pollution and corrosion of a wafer surface in the wafer polishing process by a method wherein the roughness of the surface of a synthetic resin film in contact with an adhesive layer is specified. CONSTITUTION:The title wafer processing film is composed of a filmy substrate, an adhesive layer formed on one side of the substrate and a synthetic resin film (separator) arranged on the adhesive layer while the roughness of the surface of the synthetic resin film in contact with the adhesive layer shall exceed 2mum. As for the material of the separator, the synthetic resins such as polyolefin, polyester, polyamide, polyacryl, polypropylene, etc., may be enumer ated but the polypropylene is recommended as the optimum one. Also as for the properties of the separator, the Shore D type hardness exceeding 30, the content of lubricant not exceeding 0.5wt.% to 100wt.% synthetic resin are recommended. Furthermore, as for the thickness of the separator, 10-2000mum is preferable but 20-200mum is recommended to be optimum.</p> |
