| 摘要 |
PURPOSE:To eliminate shortage in strength at the stitch bond part of a wire due to a capillary for a fine pad pitch by applying pressure to the wire part at the stitch bond part of the wire or near it again. CONSTITUTION:A wire 6 is joined to a lead 7 by a capillary for fine pad pitch 2 whose tip diameter is made smaller than a conventional capillary 1. A tip circular part 4 of the capillary for fine pad pitch 2 has a small radius so that the joint surface of a stitch bond part 13 to be formed becomes small and then further press by a tool 3 which is in the same shape as the conventional capillary 1 with a larger radius of the tip circular part 14 causes the stitch bond part 13 to be collapsed, thus enlarging the joint surface and improving the joint force between the wire 6 and the lead 7. |
