| 摘要 |
<p>A multi-metal layer interconnect tape (30) is provided. The tape (30) is not supported by a dielectric carrier. A thin dielectric adhesive layer (22) separates at least two self supporting metal foil layers (11, 12). In one embodiment of the invention, conductive vias (20) electrically interconnect leads (14') formed in a first metal foil layer (11) with ground (18) and power (16) circuits formed in a second metal foil layer (12). The metal foil layers (11, 12) are in close proximity so the vias (20) have a low aspect ratio. The vias (20) may be readily coated with continuous film of a conductive metal (26) and are much easier to clean than conventional vias having significantly higher aspect ratios.</p> |
