| 摘要 |
<p>Semiconductor wafers (11) within a supporting vertical wafer tower are positioned within a vertical process chamber (12) through a lower gate valve (20) fixed to a supporting framework (37). The gate valve (20) is sealed to a similar gate (50) valve at the upper end of a movable load lock (40, 45) on the framework, within which the wafers (11) are subjected to pre-treatment and post-treatment processes. Two load locks (40, 45) are alternately used in conjunction with the process chamber (12) and a wafer loading station above an aperture (91) on the framework. In addition, a cleaning element (110) is movably mounted on the framework (37) for periodically maintaining the interior surfaces (15) of the process tube (13) within the process chamber (12).</p> |
