| 摘要 |
THREE DIMENSIONAL ELECTRONIC UNIT AND METHOD OF FABRICATING SAME The essence of the invention consists in that the unpackaged electronic elements incorporated into the unit are preliminary grouped so that each carrier (1) needs a minimum number of edge connectors (5). In fitting the electronic elements into the carriers (1), the elements are oriented relative to each other and are temporarily fixed. On shaping the carriers (1), the elements are finally fixed. An insulating layer (6) is deposited on the current-conducting zones of the elements, save the bonding pads (14). The bonding pads (14) and the edge connectors (5) of the carriers (1) are cleaned of organic impurities and metal oxides. Conductors (7) connecting the carriers (1) to each other in the unit and the electronic elements to each other and/or to the edge connectors (5) are applied to the surfaces of the elements and the carriers (1). The unit is provided with means of heat dissipation, each whereof consists of heat-transfer ribs (22) located in the zones of heat generation and a heat sink (23), and means of connecting the carriers (1) by way of side surfaces of the unit. Each of the carriers (1) has at least one terminal extending to the surface of the unit for connection to external circuits. The edge connectors (5) of the carriers (1) are electrically connected at the surface of the unit, and the unit is placed into an air-tight package (21). |
