| 摘要 |
PURPOSE:To enhance productivity using a single device without needing a special device compared to the case where an adhesive sheet is used and to contrive a reduction in cost by a method wherein a fixing of an insulating substrate on a bed is performed using an insulative bonding agent. CONSTITUTION:An insulative bonding agent 3 is applied on the surface of a stamp stand 1 conformed to the shape of an insulating substrate 5. This stamp stand 1 is stamped at a desired position on a bed 2a and an insulative bonding agent 4 is applied. Here, as the agent, 4, an insulative bonding agent, which contains an epoxy resin as its main agent and contains 30% or more of silicon oxide as a filler, is used. A semiconductor pellet 5 held by a collet 6 is pressed from over the bonding agent 4, a lead frame 2 and all are put in an oven, are heated, are thermoset and a fixing of the insulating substrate on the bed is completed.
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