| 发明名称 |
SUBSTRATE FOR PACKAGING A SEMICONDUCTOR DEVICE |
| 摘要 |
A substrate (3) for packaging a semiconductor device having a bump (2) thereon according to the present invention is characterized in that the substrate (3) has an electrode terminal (5) to which the bump (2) is to be connected and a recess (4) for receiving at least a top of the bump (2) is formed in the electrode terminal (5). <IMAGE> |
| 申请公布号 |
AU6982291(A) |
申请公布日期 |
1991.07.25 |
| 申请号 |
AU19910069822 |
申请日期 |
1991.01.22 |
| 申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
MASANORI NISHIGUCHI;ATSUSHI MIKI |
| 分类号 |
H01L21/60;H01L23/13;H05K1/00;H05K3/34;H05K3/40 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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