| 摘要 |
PURPOSE:To improve reliability by minimizing the level variation for reduction in noise with a grounding conductor only or a grounding conductor and a power supply conductor provided at the bottom of and also around the sides of the chip inside the package. CONSTITUTION:In a package composed of ceramic, for example, the grounding conductor 10 consisting of a bottom conductor 11, side conductors 12 and exposed conductors 13 is provided at the cavity for accommodating the IC chip 1. A wide connecting conductor 14 is provided for connection between the ground conductor 10 and an external terminal by forming an underneath layer which is different from the bond wirings 2. On the exposed conductors 13, ground wire bonding is applied. Other than the layer of the ground conductor 10, an another conductor layers, the power supply conductor 15, may be provided in double layer construction with a ceramic sheet interlaid. This layer consists likewise of a bottom conductor 16, side conductors 17, exposed conductors 18 and connecting conductor 19. This construction gives higher reliability which can allow preventing variation of the grounding level or power supply level. |
