发明名称 |
Surface mount method and device. |
摘要 |
<p>Method and device are provided for use in the initial manufacture of surface mount printed circuit board (14) assemblies or for use in the replacement and repair of J-leads surface mount electrical components (12) on printed circuit boards (14). The device comprises socket means (30) for receiving a surface mount electrical component (12), and a plurality of contact elements (32) mounted on said socket means (30), each of said contact elements (32) having a first portion (50) for soldering the contact element (32) to a conductive pad (22) on a printed circuit board (14) and a second portion (52) for soldering said contact element (32) to a J-shaped lead (18) of said electrical component. <IMAGE></p> |
申请公布号 |
EP0438238(A2) |
申请公布日期 |
1991.07.24 |
申请号 |
EP19910300211 |
申请日期 |
1991.01.11 |
申请人 |
HEWLETT-PACKARD COMPANY |
发明人 |
MASON, SCOTT C.;SLUTZ, ROBERT A. |
分类号 |
H05K3/30;H05K3/32;H05K7/10 |
主分类号 |
H05K3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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