发明名称 |
CONDUCTIVE ADHESIVE |
摘要 |
PURPOSE:To obtain a conductive adhesive which can prevent the bending or cracking of a semiconductor pellet and is useful for bonding a semiconductor pellet with a tub by using a specified addition reaction-curing conductive silicone rubber composition. CONSTITUTION:This adhesive is prepared from an addition reaction-curing conductive silicone rubber composition containing at most 500ppm of a low- molecular siloxane having a vapor pressure >=10mmHg at 200 deg.C [e.g. a compound of formula I or II (wherein (n) is 3-25; and (m) is 1-25)] (e.g. a composition obtained by mixing a vinylated polysiloxane with an Si-bonded H-containing polysiloxane, a silver powder and a chloroplatinic acid/olefin complex). |
申请公布号 |
JPH03170581(A) |
申请公布日期 |
1991.07.24 |
申请号 |
JP19890311013 |
申请日期 |
1989.11.30 |
申请人 |
TORAY DOW CORNING SILICONE CO LTD |
发明人 |
NAKAYOSHI KAZUMI;MINE KATSUTOSHI |
分类号 |
C09J183/05;C08L83/07;C09J9/02;C09J11/04;C09J183/00;C09J183/07;H01B1/12;H01L21/60;H01L23/495;H01R4/04 |
主分类号 |
C09J183/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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