| 发明名称 |
METHOD OF BONDING GOLD OR GOLD ALLOY WIRE TO SOLDER |
| 摘要 |
A compression bond is formed between a gold or gold alloy wire (12) and a solder (16) such as lead/tin by forming a head (14) on the wire and forcing the head into a pad of the solder by thermosonic, or thermocompression, or ultrasonic compression bonding techniques. This forms a gold/solder intermetallic compound which in turn forms the bond. The head of the wire is maintained out of contact with any underlying surface, and surrounded by the solder. |
| 申请公布号 |
EP0365919(A3) |
申请公布日期 |
1991.07.24 |
| 申请号 |
EP19890118870 |
申请日期 |
1989.10.11 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CONRU, H. WARD;GONS, STEPHEN E.;OSBORNE, GORDON C. JR.;PHELPS, DOUGLAS W., JR.;STARR, STEPHEN G.;WARD, WILLIAM C. |
| 分类号 |
H01R43/00;B23K20/02;B23K20/10;B23K20/22;B23K35/00;H01L21/00;H01L21/607;H01R43/02;H05K3/32;H05K3/34 |
主分类号 |
H01R43/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
