| 发明名称 |
SUBSTRATE FOR PACKAGING A SEMICONDUCTOR DEVICE |
| 摘要 |
A substrate for packaging a semiconductor device having a bump thereon according to the present invention is characterized by that the substrate has an electrode terminal to which the bump is to be connected, and a recess for receiving at least a top of the bump is formed in the electrode terminal. |
| 申请公布号 |
CA2034703(A1) |
申请公布日期 |
1991.07.24 |
| 申请号 |
CA19912034703 |
申请日期 |
1991.01.22 |
| 申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
NISHIGUCHI, MASANORI;MIKI, ATSUSHI |
| 分类号 |
H01L21/60;H01L23/13;H05K1/00;H05K3/34;H05K3/40;(IPC1-7):H01L23/12 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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