发明名称 |
MASTER SLICE SEMICONDUCTOR DEVICE |
摘要 |
<p>A bonding pad (2) to be bonded to a lead electrode is formed to have an opening (7) with a substantially square plane shape, and a bonding pad (3) which is not to be bonded to a lead electrode is formed to have an opening (7) with a substantially square plane shape with a notched position (5a) in the center. The outer shapes of the electrode pads (2, 3) are varied in accordance with packages which contain semiconductor chip.</p> |
申请公布号 |
EP0402592(A3) |
申请公布日期 |
1991.07.24 |
申请号 |
EP19900107407 |
申请日期 |
1990.04.19 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
ARAKI, TOMOKAZU, C/O INTELLECTUAL PROPERTY DIV. |
分类号 |
H01L21/822;H01L21/82;H01L23/485;H01L27/04;H01L27/118;(IPC1-7):H01L23/485 |
主分类号 |
H01L21/822 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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