| 摘要 |
APPARATUS FOR DRY PROCESSING A SEMICONDUCTOR WAFER A method and apparatus of dry processing a semiconductor wafer including processes of vacuum baking and dry silylation provides a gaseous atmosphere of pressure up to 760 Torr against the surface of the wafer, one or more of the constituents of the gas being obtained from a liquid fluid source of the constituent, including a metering device that controls flow of the liquid fluid from a remote reservoir and feeds it to a vaporizer that converts the fluid to a vapor gas at pressure up to 760 Torr and feeds the vapor gas at that pressure into a wafer processing chamber where the particular dry process involving the vapor gas is carried out on the wafer surface. In a preferred embodiment the metering device is an automotive fuel injector, sometimes referred to as a throttle body injector (TBI) that is energized by electrical pulses, each electrical pulse causing the TBI to inject a given predetermined amount into the vaporizer which heats the fluid, turning it into a vapor gas at pressure up to 760 Torr. |
